EDN

Ultra-Thin Molded Chip Scale Package

Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

Uviquity Announces the World's First Chip-Scale Deep-UV Laser at 229 nm

Uviquity, a deep-tech company developing integrated photonics for ultraviolet wavelengths, today announced its first product: ...
Semiconductor Engineering

High Performance, Multi-Chip Leadframe Package With Internal Connections

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Electronic Design

Microchip Expands UNI/O EEPROM Line With Wafer-Level Chip-Scale And TO-92 Packages

Microchip has developed a single-I/O bus UNI/O EEPROM devices in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring 0.85 mm x 1.38 mm, the ...
Electronic Design

Low-Power Microprocessor Supervisory Circuits in Chip-Scale Package

Maxim Integrated Products introduces the MAX16072-MAX16074 microprocessor supervisory circuits in a 1mm x 1mm chip-scale package Maxim Integrated Products introduces the MAX16072-MAX16074 ...
InfoWorld

Toshiba squeezes more chips into standard package

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...
ExtremeTech

Cerebras Unveils CS-3 Wafer-Scale AI Chip With 900,000 Cores and 4 Trillion Transistors

If you thought a chip like AMD's MI300A was big at 146 billion transistors, you ain't seen nothing yet. AI company Cerebras announced its third-generation AI chip, CS-3, a "wafer-scale" silicon ...
Electronics360

Advanced Chip and Circuit Materials introduces negative and near-zero CTE materials to eliminate thermomechanical constraints for large-format AI chips

Scaling of large-scale chips for AI is limited by the mismatch in CTE of circuit boards and the devices mounted on them.
AZOM

Semiconductor Integration with MEMS: Fabrication and Applications

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...